BID126024: 1st Payment of Bond Interest from 20/5/2026 inclusive to 20/11/2026 exclusive
Viet Nam Securities Depository and Clearing Corporation (VSDC) would like to announce the record date of corporate action processing for the Securities registering institution as follows:
- Executive rate: VND 3,932 per bond.
- Actual number of days for bond interest calculation during the interest payment period (from 20/5/2026 inclusive to 20/11/2026 exclusive): 184 days.
- Bond interest is calculated according to the following formula = Total par value of bonds held as of the record date × 7.8% × 184/365.
+ The total amount of bond interest actually received by the bondholder is rounded to the whole number (if the first dp is equal to or greater than 5, the amount is rounded up; if the first dp is less than 5 then the fractional part is removed);
- Payment date: 20/11/2026
- Payment place:
+ The holders whose bonds have been deposited will receive bond interest at the depository member where they opened depository account.
+ The holders whose securities have not been deposited will complete procedures to receive bond interest payments at BIDV – Ha Thanh Branch (on business days), starting from 20/11/2026, ID cards have to be presented.
Coordination details and procedures for corporate action processing for holders of the above securities between VSDC, the Securities registering institution and depository members are specified in the Guideline on corporate action processing for securities holders at VSDC.
Joint Stock Commercial Bank for Investment and Development of Vietnam and the parties involved in the process of preparing the dossier, documents of corporate action processing are fully responsible before the law for the legality, accuracy, truthfulness and completeness of the dossier; Institutions and individuals participating in the confirmation of records and documents shall be legally responsible within the scope related to such records and documents as prescribed in Clause 1, Article 11a of the Securities Law No. 54/2019/QH14 dated 26/11/2019, supplemented by Clause 4, Article 1 of Law No. 56/2024/QH15 dated 29/11/2024.
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BID126024: Bond Registration
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